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  • ATS-02A-35-C2-R0

  • AI
    The **ATS-02A-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling processors and other high-heat electronic chips. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Thermal Resistance** | 12.83°C/W (@ 100 LFM) | | **Fin Pattern** | Straight | --- ### 2. Detailed Electronic Part Breakdown #### A. The Heat Sink Body The core component is made of **6063-T5 aluminum**, which provides an excellent balance of thermal conductivity and structural rigidity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and increases emissivity for better radiative cooling. #### B. The Attachment Mechanism (Push-Pin) This specific part number uses a **Push-Pin** assembly. This is crucial for electronic PCB design because: * **Ease of Assembly:** It allows for quick installation on the production line. * **Constant Pressure:** The integrated springs ensure that the heat sink maintains a consistent downward force on the electronic component (CPU/GPU), which optimizes the thermal interface. * **Pre-drilled Holes:** This requires the PCB to have specific 3.0mm holes designed to accept the pins. #### C. Thermal Interface Material (TIM) Most ATS heat sinks in this series come with **pre-applied thermal tape** or grease. For the "C2" variant, it typically features high-performance thermal pads to ensure there are no air gaps between the chip and the aluminum base. --- ### 3. Airflow Performance Data The cooling efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.83 | | 200 (1.0 m/s) | 8.31 | | 400 (2.0 m/s) | 6.03 | | 600 (3.0 m/s) | 4.95 | --- ### 4. Part Number Decoder * **ATS**: Manufacturer (Advanced Thermal Solutions) * **02**: Series Number * **A**: Attachment Type (Push-Pin) * **35**: Footprint Size (35mm x 35mm) * **C2**: Thermal Performance/Material Grade * **R0**: RoHS Compliant / Revision code
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required LFM for my specific chip wattage?
    • ⤷ What are the PCB hole requirements for the push-pin mounting?
    • ⤷ Does this heat sink come with pre-applied thermal interface material?