ATS-02A-35-C2-R0
AI

The **ATS-02A-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling processors and other high-heat electronic chips.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm |
| **Thermal Resistance** | 12.83°C/W (@ 100 LFM) |
| **Fin Pattern** | Straight |
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### 2. Detailed Electronic Part Breakdown
#### A. The Heat Sink Body
The core component is made of **6063-T5 aluminum**, which provides an excellent balance of thermal conductivity and structural rigidity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and increases emissivity for better radiative cooling.
#### B. The Attachment Mechanism (Push-Pin)
This specific part number uses a **Push-Pin** assembly. This is crucial for electronic PCB design because:
* **Ease of Assembly:** It allows for quick installation on the production line.
* **Constant Pressure:** The integrated springs ensure that the heat sink maintains a consistent downward force on the electronic component (CPU/GPU), which optimizes the thermal interface.
* **Pre-drilled Holes:** This requires the PCB to have specific 3.0mm holes designed to accept the pins.
#### C. Thermal Interface Material (TIM)
Most ATS heat sinks in this series come with **pre-applied thermal tape** or grease. For the "C2" variant, it typically features high-performance thermal pads to ensure there are no air gaps between the chip and the aluminum base.
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### 3. Airflow Performance Data
The cooling efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 12.83 |
| 200 (1.0 m/s) | 8.31 |
| 400 (2.0 m/s) | 6.03 |
| 600 (3.0 m/s) | 4.95 |
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### 4. Part Number Decoder
* **ATS**: Manufacturer (Advanced Thermal Solutions)
* **02**: Series Number
* **A**: Attachment Type (Push-Pin)
* **35**: Footprint Size (35mm x 35mm)
* **C2**: Thermal Performance/Material Grade
* **R0**: RoHS Compliant / Revision code
- ⤷
How do I calculate the required LFM for my specific chip wattage?
- ⤷ What are the PCB hole requirements for the push-pin mounting?
- ⤷ Does this heat sink come with pre-applied thermal interface material?