| Fabricant | No de pièce | Fiches technique | Description |
 Unisonic Technologies |
3LN01ML-AL3-R
|
170Kb/3P
|
N CHANNEL SILICON MOSFET GENERAL-PURPOSE SWITCHING DEVICE APPLICATIONS
|
| Search Partnumber :
Start with "1ML-AL3-R" -
Total : 100 ( 1/5 Page) |
 RMT Ltd. |
1ML06-017
|
838Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05
|
392Kb/4P |
Thermoelectric Module
|
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1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
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1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized)
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1ML06-017-05AN
|
386Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05AN05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05AN25
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05T
|
390Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07
|
392Kb/4P |
Thermoelectric Module
|
|
1ML06-017-07
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1ML06-017-07AN
|
386Kb/4P |
Thermoelectric Module
|
|
1ML06-017-07AN05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07AN25
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07T
|
390Kb/4P |
Thermoelectric Module
|
|
1ML06-017-07T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|