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STM32F042C4 Fiches technique(PDF) 102 Page - STMicroelectronics |
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STM32F042C4 Fiches technique(HTML) 102 Page - STMicroelectronics |
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102 / 117 page ![]() Package information STM32F042x4 STM32F042x6 102/117 DocID025832 Rev 5 Figure 45. UFQFPN32 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. It is referred to as pin 0 in Table: Pin definitions. |
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