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STM8L151C2 Fiches technique(PDF) 121 Page - STMicroelectronics

No de pièce STM8L151C2
Description  Reset and supply management
PDF  122 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM8L151C2 Fiches technique(HTML) 121 Page - STMicroelectronics

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DocID018780 Rev 9
121/122
STM8L151x2, STM8L151x3
Revision history
121
18-Dec-2014
6
Updated Section: UFQFPN20 package information.
Replaced “ultralow power” occurrences with “ultra-low-
power”, and “Low density” with “low-density” where
applicable.
08-Apr-2015
7
Added:
– Figure 44: LQFP48 marking example (package top
view),
– Figure 47: UFQFPN32 marking example (package top
view),
– Figure 50: UFQFPN28 marking example (package top
view),
– Figure 53: UFQFPN20 marking example (package top
view),
– Figure 56: TSSOP20 marking example (package top
view).
Updated:
– Table 63: Low-density STM8L151x2/3 ordering
information scheme.
Moved Section 10.7: Thermal characteristics to
Section 10: Package information.
01-Oct-2016
8
In Table 4: Low-density STM8L151x2/3 pin description
row corresponding to pin names PD6/ADC1_IN8 /
RTC_CALIB/COMP1_INP, inserted pin number 35 in
LQFP48 column.
12-May-2017
9
Updated:
– Figure 51: UFQFPN20 - 20-lead, 3x3 mm, 0.5 mm
pitch, ultra thin fine pitch quad flat package outline
– Table 60: UFQFPN20 - 20-lead, 3x3 mm, 0.5 mm
pitch, ultra thin fine pitch quad flat package
mechanical data
– Table 45: TS characteristics
– Section 9.2: Absolute maximum ratings
– Updated all document’s footnotes from “Data
guaranteed by design, not tested in production” (or
similar) to “Guaranteed by design” and “Data based
on characterization results, not tested in production.”
(or similar) to “Guaranteed by design.”
– Section : Device marking on page 105
– Section : Device marking on page 108
– Section : Device marking on page 111
– Section : Device marking on page 114
– Section : Device marking on page 117
Table 64. Document revision history (continued)
Date
Revision
Changes



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