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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STM32F446RC Fiches technique(PDF) 187 Page - STMicroelectronics |
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STM32F446RC Fiches technique(HTML) 187 Page - STMicroelectronics |
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187 / 202 page  DocID027107 Rev 6 187/202 STM32F446xC/E Package information 199 Figure 77. UFBGA144 - 144-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 112. UFBGA144 recommended PCB design rules (0.50 mm pitch BGA) Dimension Recommended values Pitch 0.50 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 111. UFBGA144 - 144-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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