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PIC876 Fiches technique(PDF) 196 Page - Microchip Technology

No de pièce PIC876
Description  28/40-pin 8-Bit CMOS FLASH Microcontrollers
PDF  218 Pages
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Fabricant  MICROCHIP [Microchip Technology]
Site Internet  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC876 Fiches technique(HTML) 196 Page - Microchip Technology

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PIC16F87X
DS30292C-page 194
 2001 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
1.14
0.89
0.64
.045
.035
.025
CH
Pin 1 Corner Chamfer
1.00
.039
(F)
Footprint (Reference)
(F)
A
A1
A2
α
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
44
44
Pitch
p
.031
0.80
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
§
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Foot Angle
φ
03.5
7
0
3.5
7
Overall Width
E
.463
.472
.482
11.75
12.00
12.25
Overall Length
D
.463
.472
.482
11.75
12.00
12.25
Molded Package Width
E1
.390
.394
.398
9.90
10.00
10.10
Molded Package Length
D1
.390
.394
.398
9.90
10.00
10.10
Pins per Side
n1
11
11
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.012
.015
.017
0.30
0.38
0.44
Mold Draft Angle Top
α
51015
5
10
15
Mold Draft Angle Bottom
β
51015
5
10
15
CH x 45
°
§ Significant Characteristic



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