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CF745 Fiches technique(PDF) 203 Page - Microchip Technology |
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CF745 Fiches technique(HTML) 203 Page - Microchip Technology |
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203 / 217 page ![]() © 1998 Microchip Technology Inc. Preliminary DS30453B-page 203 PIC16C5X Package Type: K04-013 28-Lead Ceramic Dual In-line with Window (JW) – 600 mil * Controlling Parameter. n 1 2 R MIN Window Diameter Overall Row Spacing Radius to Radius Width Package Width Package Length Tip to Seating Plane Base to Seating Plane Top of Lead to Seating Plane Top to Seating Plane Lead Thickness Shoulder Radius Upper Lead Width Lower Lead Width Number of Pins PCB Row Spacing Dimension Limits Units Pitch W eB E1 A2 D E L A A1 c R B1 B p n 7.37 1.52 3.70 5.08 0.30 0.25 1.65 0.53 2.59 0.280 0.660 0.580 0.520 1.460 0.138 0.038 0.128 0.185 0.010 0.270 0.610 0.560 0.015 0.514 1.430 0.125 0.110 0.170 0.008 0.290 0.710 0.600 0.060 0.526 1.490 0.150 0.146 0.200 0.012 0.005 0.058 0.019 0.100 0.600 INCHES* 0.098 0.000 0.050 0.016 NOM MAX 28 0.102 0.010 0.065 0.021 37.08 6.86 15.49 14.22 13.06 36.32 3.18 0.00 2.78 4.32 0.20 7.11 16.76 14.73 18.03 15.24 0.95 3.49 13.21 3.24 4.70 0.25 13.36 37.85 3.81 NOM MILLIMETERS 0.00 1.27 0.41 2.49 MIN 2.54 0.13 1.46 0.47 28 15.24 MAX D E W c E1 eB p A1 L B1 B A2 A |
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