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CF745 Fiches technique(PDF) 136 Page - Microchip Technology

No de pièce CF745
Description  EPROM/ROM-Based 8-Bit CMOS Microcontroller Series
PDF  217 Pages
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Fabricant  MICROCHIP [Microchip Technology]
Site Internet  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

CF745 Fiches technique(HTML) 136 Page - Microchip Technology

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PIC16C5X
PIC16C58A
DS30453B-page 136
Preliminary
© 1998 Microchip Technology Inc.
16.4
DC Characteristics: PIC16LV58A-02 (Commercial)
PIC16LV58A-02 (Industrial)
DC Characteristics
Power Supply Pins
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0
°C ≤ TA ≤ +70°C (commercial)
–20
°C ≤ TA ≤ +85°C (industrial)
Characteristic
Sym
Min
Typ(1) Max Units
Conditions
Supply Voltage
XT, RC and LP options
VDD
2.0
3.8
V
RAM Data Retention Voltage(2)
VDR
1.5*
V
Device in SLEEP mode
VDD start voltage to ensure
Power-On Reset
VPOR
—VSS
V
See section on Power-On Reset for details
VDD rise rate to ensure
Power-On Reset
SVDD
0.05*
V/ms See section on Power-On Reset for details
Supply Current(3)
XT and RC(4) options
LP option, Commercial
LP option, Industrial
IDD
0.5
11
14
1.8
27
35
mA
µA
µA
FOSC = 2.0 MHz, VDD = 3.0V
FOSC = 32 kHz, VDD = 2.5V, WDT disabled
FOSC = 32 kHz, VDD = 2.5V, WDT disabled
Power Down Current(5)(6)
Commercial
Industrial
IPD
2.5
0.25
2.5
0.25
12
4.0
14
5.0
µA
µA
µA
µA
VDD = 2.5V, WDT enabled
VDD = 2.5V, WDT disabled
VDD = 2.5V, WDT enabled
VDD = 2.5V, WDT disabled
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25
°C.This data is for design guidance
only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in k
Ω.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
6: The oscillator start-up time can be as much as 8 seconds for XT and LP oscillator selection, if the SLEEP
mode is entered or during initial power-up.



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