8

LT1220

© LINEAR TECHNOLOGY CORPORATION 1991

LT/GP 0894 5K REV A • PRINTED IN USA

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7487

SI PLIFIED SCHE ATIC

6 OUT

LT1220 • SS

BIAS 2

BIAS 1

18

NULL

–IN

+IN 3

7

2

4

Dimensions in inches (millimeters) unless otherwise noted.

NOTE: LEAD DIAMETER IS UNCONTROLLED BETWEEN

THE REFERENCE PLANE AND SEATING PLANE.

0.200 – 0.230

(5.080 – 5.842)

BSC

0.027 – 0.045

(0.686 – 1.143)

0.027 – 0.034

(0.686 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

45°TYP

0.050

(1.270)

MAX

0.016 – 0.021

(0.406 – 0.533)

0.010 – 0.045

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.005

(0.127)

MIN

0.405

(10.287)

MAX

0.220 – 0.310

(5.588 – 7.874)

12

3

4

87

65

0.025

(0.635)

RAD TYP

0.045 – 0.068

(1.143 – 1.727)

FULL LEAD

OPTION

0.023 – 0.045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

0.014 – 0.026

(0.360 – 0.660)

0.200

(5.080)

MAX

0.015 – 0.060

(0.381 – 1.524)

0.125

3.175

MIN

0.100 ± 0.010

(2.540 ± 0.254)

0.045 – 0.068

(1.143 – 1.727)

0.300 BSC

(0.762 BSC)

0.008 – 0.018

(0.203 – 0.457)

0° – 15°

0.385 ± 0.025

(9.779 ± 0.635)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER

DIP/PLATE OR TIN PLATE LEADS.

0.009 – 0.015

(0.229 – 0.381)

0.300 – 0.325

(7.620 – 8.255)

0.325

+0.025

–0.015

+0.635

–0.381

8.255

()

0.045 ± 0.015

(1.143 ± 0.381)

0.100 ± 0.010

(2.540 ± 0.254)

0.065

(1.651)

TYP

0.045 – 0.065

(1.143 – 1.651)

0.130 ± 0.005

(3.302 ± 0.127)

0.015

(0.380)

MIN

0.018 ± 0.003

(0.457 ± 0.076)

0.125

(3.175)

MIN

12

3

4

87

6

5

0.255 ± 0.015*

(6.477 ± 0.381)

0.400*

(10.160)

MAX

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR

PROTRUSIONS. MOLD FLASH OR PROTURSIONS SHALL

NOT EXCEED 0.010 INCH (0.254mm).

0.016 – 0.050

0.406 – 1.270

0.010 – 0.020

(0.254 – 0.508)

× 45°

0°– 8° TYP

0.008 – 0.010

(0.203 – 0.254)

0.053 – 0.069

(1.346 – 1.752)

0.014 – 0.019

(0.355 – 0.483)

0.004 – 0.010

(0.101 – 0.254)

0.050

(1.270)

BSC

1

2

3

4

0.150 – 0.157*

(3.810 – 3.988)

8

7

6

5

0.189 – 0.197*

(4.801 – 5.004)

0.228 – 0.244

(5.791 – 6.197)

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).

H8 Package

8-Lead TO-5

Metal Can

J8 Package

8-Lead Ceramic Dip

N8 Package

8-Lead Plastic Dip

S8 Package

8-Lead Plastic SOIC