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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ADNS-7550 Fiches technique(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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ADNS-7550 Fiches technique(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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5 / 32 page  5 Figure 5. Recommended PCB mechanical cutouts and spacing Assembly Recommendation 1. Insert the integrated molded lead-frame DIP sensor and all other electrical components into the application PCB. 2. This sensor package is only qualified for wave-solder process. 3. Wave-solder the entire assembly in a no-wash solder process utilizing a solder fixture. The solder fixture is needed to protect the sensor during the solder process. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact. 4. Place the lens onto the base plate. Care must be taken to avoid contamination on the optical surfaces. 5. Remove the protective kapton tapes from the optical aperture of the sensor and VCSEL respectively. Care must be taken to keep contaminants from entering the aperture. 6. Insert the PCB assembly over the lens onto the base plate. The sensor package should self-align to the lens. The optical position reference for the PCB is set by the base plate and lens. The alignment guide post of the lens locks the lens and integrated molded lead-frame DIP sensor together. Note that the PCB motion due to button presses must be minimized to maintain optical alignment. 7. Optional: The lens can be permanently locked to the sensor package by melting the lens’ guide posts over the sensor with heat staking process. 8. Tune the laser output power from the VCSEL to meet the Eye Safe Class I Standard as detailed in the LASER Power Adjustment Procedure. 9. Install the mouse top case. There must be a feature in the top case (or other area) to press down onto the sensor to ensure the sensor and lenses are interlocked to the correct vertical height. Design considerations for improving ESD Performance For improved electrostatic discharge performance, typical creepage and clearance distance are shown in the table below. Assumption: base plate construction as per the Avago supplied IGES file and ADNS-6150, ADNS- 6160-001 or ADNS-6170-002 lens: Lens ADNS-6150 ADNS-6160-001 ADNS-6170-002 Creepage 12.0 mm 13.50 mm 20.30 mm Clearance 2.1 mm 1.28 mm 1.28 mm Note that the lens material is polycarbonate and therefore, cyanoacrylate based adhesives or other adhesives that may damage the lens should NOT be used. Optical center Pin #1 7X 1.78 0.070 0.89 0.035 3.18 0.125 Lens interference 2.31 0.091 13.35 0.526 (2.78) 0.110 14.18 0.558 ∅ 1.10 Pad ring 0.043 16X ∅ 0.70 0.028 0 0 |
Numéro de pièce similaire - ADNS-7550 |
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Description similaire - ADNS-7550 |
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