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PIC16F882-I Fiches technique(PDF) 303 Page - Microchip Technology |
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PIC16F882-I Fiches technique(HTML) 303 Page - Microchip Technology |
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303 / 328 page ![]() © 2009 Microchip Technology Inc. DS41291F-page 301 PIC16F882/883/884/886/887 19.0 PACKAGING INFORMATION 19.1 Package Marking Information 3 e 28-Lead QFN XXXXXXXX XXXXXXXX YYWWNNN Example 16F886 /ML 0710017 28-Lead SOIC (7.50 mm) XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example PIC16F886/SO 0710017 28-Lead PDIP XXXXXXXXXXXXXXX XXXXXXXXXXXXXXX YYWWNNN XXXXXXXXXXXXXXX Example PIC16F883 0710017 28-Lead SSOP XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example PIC16F883 -I/SS 0710017 -I/P 3 e 3 e 3 e Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e |
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