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DRV8803 Fiches technique(PDF) 4 Page - Texas Instruments |
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DRV8803 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 15 page DRV8803 SLVSAW5A – JULY 2011 – REVISED JULY 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE UNIT VM Power supply voltage range –0.3 to 65 V VOUTx Output voltage range –0.3 to 65 V VCLAMP Clamp voltage range –0.3 to 65 V nFAULT Output current 20 mA Peak clamp diode current 1.5 A DC or RMS clamp diode current 1 A Digital input pin voltage range –0.5 to 7 V nFAULT Digital output pin voltage range –0.5 to 7 V Peak motor drive output current, t < 1 μS Internally limited A Continuous total power dissipation See Dissipation Ratings table TJ Operating virtual junction temperature range –40 to 150 °C Tstg Storage temperature range –60 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute –maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. THERMAL INFORMATION DRV8803 THERMAL METRIC DW UNITS 20 PINS θJA Junction-to-ambient thermal resistance(1) 67.7 θJCtop Junction-to-case (top) thermal resistance(2) 32.9 θJB Junction-to-board thermal resistance(3) 35.4 °C/W ψJT Junction-to-top characterization parameter(4) 8.2 ψJB Junction-to-board characterization parameter(5) 34.9 θJCbot Junction-to-case (bottom) thermal resistance(6) N/A (1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (4) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): DRV8803 |
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