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M24LR64-RMB6T2 Fiches technique(PDF) 122 Page - STMicroelectronics |
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M24LR64-RMB6T2 Fiches technique(HTML) 122 Page - STMicroelectronics |
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122 / 128 page ![]() Part numbering M24LR64-R 122/128 Doc ID 15170 Rev 10 Note: 1 Refer to technical note TN0185 for details on the die delivery form. For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST sales office. Table 112. Ordering information scheme for bare die devices Example: M24LR64-R S 1 8 5 /2 Device type M24LR64 = Dual interface EEPROM Operating voltage R = VCC = 1.8 to 5.5 V Packing S = Sawn wafer in UV tape Wafer orientation 1 = see Note 1 Wafer size in inches 8 = 8-inch wafer (see Note 1) Wafer thickness 5 = 140 µm (see Note 1) Capacitance /2 = 27.5 pF |
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