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STM32F103xC Fiches technique(PDF) 107 Page - STMicroelectronics |
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STM32F103xC Fiches technique(HTML) 107 Page - STMicroelectronics |
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107 / 123 page ![]() STM32F103xC, STM32F103xD, STM32F103xE Package characteristics Doc ID 14611 Rev 7 107/123 Figure 59. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package outline 1. Drawing is not to scale. Table 64. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Typ Min Max A1.70 0.0669 A1 0.21 0.0083 A2 1.07 0.0421 A3 0.27 0.0106 A4 0.85 0.0335 b 0.35 0.40 0.45 0.0138 0.0157 0.0177 D 9.85 10.00 10.15 0.3878 0.3937 0.3996 D1 8.80 0.3465 E 9.85 10.00 10.15 0.3878 0.3937 0.3996 E1 8.80 0.3465 e0.80 0.0315 F0.60 0.0236 ddd 0.10 0.0039 eee 0.15 0.0059 fff 0.08 0.0031 Seating plane C A2 A4 A3 C ddd A1 A B A D1 e F D F E1 E e M eee M CA B C fff (144 balls) Øb M Ø Ø X3_ME Ball A1 |
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