NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

15.01.2008

HIGH VOLTAGE CHIP CAPACITORS

V2N SERIES

7. RELIABILITY & TEST CONDITION :

Resistance to Soldering Heat

Humidity

Temperature Cycle

ITEM

Solderability

Measure at room temp. after cooling for

Class II capacitor shall be set for 48±4 hrs at room

temp. after 1 hr heat treatment at 150+0/-10°C before

Solder the capacitor on P.C. board before testing

Solder the capacitor on P.C. board before testing

temp. after 1 hr heat treatment at 150+0/-10°C before

Class II capacitor shall be set for 48±4 hrs at room

30

30

Time (min)

No mechanical damage shall be occur

Within ±30%

value

Capacitance change

Within ±5.0% or ±0.5pF

whichever is larger of initial

Capacitance change

Within ±15%

Z/E

Char.

Class II :

X

Char.

Class I :

N

Temperature : 40±2°C

Relative Humidity : 90~95% RH

Test Time : 500 +12/-0 hr

Measure at room temp. after cooling for

Class II : 48±4 hrs

Class I : 24±2 hrs

initial measure.

Insulation Resistance & Withstand Voltage :

N

whichever is larger of initial

Within ±20%

Within ±7.5%

Capacitance change

value

To satisfy the specified initial value

Insulation Resistance :

Q(Class I), Tan (Class II) &

Y/Z/E

Appearance :

Class II :

X/B

Char.

Within ±20%

Capacitance change

Within ±2.5% or ±0.25pF

No mechanical damage shall be occur

To satisfy the specified initial value

Q(Class I), Tan (Class II),

Within ±10%

Class I :

Char.

Appearance :

Z/E

X

25

2

3

Measure at room temp. after cooling for

Class II : 48±4 hrs

Min. rated temp. +3/-0

Class I : 24±2 hrs

4

3

25

3

Class II : 48±4 hrs

Min. rated temp. +0/-3

Temp. (°C)

Step

initial measure.

1

Class I : 24±2 hrs

Class II capacitor shall be set for 48±4 hrs at room

temp. after 1 hr heat treatment at 150+0/-10°C before

TEST CONDITION

soldered newly, so metal part does not come

More than 90% of the terminal surface is to be

value

whichever is larger of initial

Capacitance change

No mechanical damage shall be occur

Capacitance change

Within ±2.5% or ±0.25pF

Char.

Class II :

Char.

N

Class I :

Appearance :

PERFORMANCE

out or dissolve

Flux : Rosin

Immersing speed : 25±10% mm/s

Preheat : At 80~120°C for 10~30sec

Preheat : At 150±10°C for 60~120sec

Dip Time : 10±1sec

Dip : Solder Temp. of 260±5°C

Solder : H63A

Flux : Rosin

initial measure.

Immersing Speed : 25±10% mm/s

Dip Time : 5±0.5sec

Solder Temp. : 245±5°C

Solder : H63A