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TDA4VEN...Q1 Fiches technique(PDF) 233 Page - Texas Instruments |
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TDA4VEN...Q1 Fiches technique(HTML) 233 Page - Texas Instruments |
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233 / 236 page ![]() www.ti.com PACKAGE OUTLINE C 2.473 2.245 0.357 0.257 TYP 16.9 TYP 16.9 TYP 0.65 TYP 0.65 TYP 594X 0.45 0.35 NOTE 3 PIN 1 ID 2.154 1.950 B 18.1 17.9 A 18.1 17.9 (0.55) TYP (0.55) TYP ( 13.6) ( 11.6) ( 17.6) FCBGA - 2.473 mm max height AMW0594A BALL GRID ARRAY 4229875/A 07/2023 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Ball diameter after reflow. Dimension is measured at the maximum solder ball diameter parallel to primary datum C. A B C D E F G H J K L M N P R T U V W Y BALL A1 CORNER 0.1 C SEATING PLANE 0.15 C 0.2 C 1 2 3 0.25 C A B 0.1 C PKG PKG 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 AA AB 23 24 25 26 27 AC AD AE AF AG SCALE 0.900 |
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