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PIC18F44J10-E/ML Fiches technique(PDF) 333 Page - Microchip Technology |
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PIC18F44J10-E/ML Fiches technique(HTML) 333 Page - Microchip Technology |
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333 / 358 page ![]() © 2007 Microchip Technology Inc. Preliminary DS39682C-page 331 PIC18F45J10 FAMILY 25.0 PACKAGING INFORMATION 25.1 Package Marking Information 28-Lead SPDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F24J10 0710017 28-Lead SOIC XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F24J10-I/SO 0710017 28-Lead SSOP XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example PIC18F24J10 -I/SS 0710017 28-Lead QFN XXXXXXXX XXXXXXXX YYWWNNN Example 18F24J10 -I/ML 0710017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e 3 e -I/SP |
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