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STM32H7 Fiches technique(PDF) 342 Page - STMicroelectronics |
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STM32H7 Fiches technique(HTML) 342 Page - STMicroelectronics |
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342 / 357 page ![]() Package information STM32H742xI/G STM32H743xI/G 342/357 DS12110 Rev 10 Figure 133. UFBGA(176+25) - Footprint example eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 227. UFBGA(176+25) - Example of PCB design rules (0.65 mm pitch BGA) Dimension Values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 226. UFBGA(176+25) - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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