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STM32U545NET3QTR Fiches technique(PDF) 279 Page - STMicroelectronics |
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STM32U545NET3QTR Fiches technique(HTML) 279 Page - STMicroelectronics |
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279 / 283 page ![]() DS14216 Rev 1 279/283 STM32U545xx Package information 279 Figure 75. UFBGA100 - Recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 145. UFBGA100 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 144. UFBGA100 - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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