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HC705RC16GRS/D Fiches technique(PDF) 113 Page - NXP Semiconductors

No de pièce HC705RC16GRS/D
Description  The MC68HC705RC16 is a low-cost addition to the M68HC05 Family of microcontrollers (MCUs) and is suitable for remote control applications.
PDF  120 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

HC705RC16GRS/D Fiches technique(HTML) 113 Page - NXP Semiconductors

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MC68HC705RC16 — Rev. 3.0
General Release Specification
Mechanical Specifications
General Release Specification — MC68HC705RC16
Section 13. Mechanical Specifications
13.1 Contents
13.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
13.3
28-Pin Plastic Dual In-Line Package (Case 710-02) . . . . . . .114
13.4
28-Pin Small Outline Integrated
Circuit Package (Case 751F-04) . . . . . . . . . . . . . . . . . . . .114
13.5
44-Pin Plastic Leaded Chip Carrier
Package (Case 777-02). . . . . . . . . . . . . . . . . . . . . . . . . . .115
13.2 Introduction
This section describes the dimensions of the dual-in-line package (DIP),
small outline integrated circuit (SOIC) MCU package, and the plastic
leaded chip carrier (PLCC) package.
The following figures show the latest packages at the time of this
publication. To make sure that you have the latest package
specifications, contact one of the following:
•
Local Freescale Sales Office
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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