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STM32H753II Fiches technique(PDF) 345 Page - STMicroelectronics |
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STM32H753II Fiches technique(HTML) 345 Page - STMicroelectronics |
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345 / 361 page ![]() Package information STM32H753xI 344/360 DS12117 Rev 8 Figure 138. UFBGA176+25 - Recommended footprint eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 226. UFBGA176+25 - Recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 225. UFBGA(176+25) - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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