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STM32G081EB Fiches technique(PDF) 109 Page - STMicroelectronics

No de pièce STM32G081EB
Description  Arm® Cortex®-M0 32-bit MCU, 128 KB Flash, 36 KB RAM,4x USART, timers, ADC, DAC, comm. I/Fs, AES, RNG, 1.7-3.6V
PDF  136 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G081EB Fiches technique(HTML) 109 Page - STMicroelectronics

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DS12231 Rev 4
109/136
STM32G081xB
Package information
130
6
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
6.1
WLCSP25 package information
WLCSP25 is a 25-ball, 2.30 x 2.48 mm wafer-level chip-scale package with 0.4 mm pitch.
Figure 32. WLCSP25 chip-scale package outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
A06J_WLCSP25_ME_V1
Z
A
B
C
D
E
21
3
4
5
G
e
e
e2
e1
F
A1 ball location
D
E
aaa
(4X)
BOTTOM VIEW
TOP VIEW
A
A2
A1
bbb Z
DETAIL A
A3
A2
b
FRONT VIEW
SIDE VIEW
DETAIL A
ROTATED 90
BUMP
eee Z
b (25x)
ccc
Z
Y
X
ddd
Z
M
M
A1



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