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SPC58EG80C3 Fiches technique(PDF) 112 Page - STMicroelectronics

No de pièce SPC58EG80C3
Description  32-bit Power Architecture microcontroller for automotive ASIL-D applications
PDF  139 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC58EG80C3 Fiches technique(HTML) 112 Page - STMicroelectronics

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Package information
SPC584Gx, SPC58EGx, SPC58NGx
112/139
DS11758 Rev 6
Figure 48. eLQFP176 leadframe pad design
5.2
eTQFP144 package information
Refer to Section 5.2.1: Package mechanical drawings and data information for full
description of below figures and table notes.
Table 66. eLQFP176 symbol definitions
Symbol
Definition
Notes
aaa
The tolerance that controls the position of
the terminal pattern with respect to Datum A
and B. The center of the tolerance zone for
each terminal is defined by basic dimension
e as related to Datum A and B.
For flange-molded packages, this tolerance
also applies for basic dimensions D1 and
E1. For packages tooled with intentional
terminal tip protrusions, aaa does not apply
to those protrusions.
bbb
The bilateral profile tolerance that controls
the position of the plastic body sides. The
centers of the profile zones are defined by
the basic dimensions D and E.
ccc
The unilateral tolerance located above the
seating plane where in the bottom surface of
all terminals must be located.
This tolerance is commonly know as the
“coplanarity” of the package terminals.
ddd
The tolerance that controls the position of
the terminals to each other. The centers of
the profile zones are defined by basic
dimension e.
This tolerance is normally compounded with
tolerance zone defined by “b”.
Note: number, dimensions and positions of grooves are for reference only.



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