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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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D301 Fiches technique(PDF) 402 Page - Microchip Technology |
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D301 Fiches technique(HTML) 402 Page - Microchip Technology |
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402 / 416 page  PIC24FJ256GA705 FAMILY DS30010118D-page 402 2016-2018 Microchip Technology Inc. RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pad Spacing Contact Pitch MILLIMETERS 0.50 BSC MIN E MAX 8.40 Contact Pad Length (X48) Contact Pad Width (X48) Y1 X1 1.50 0.30 Microchip Technology Drawing C04-2300-PT Rev A NOM 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] C1 C2 E X1 Y1 G C1 Contact Pad Spacing 8.40 Distance Between Pads G 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: SILK SCREEN 12 48 |
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