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STM32F302C8 Fiches technique(PDF) 119 Page - STMicroelectronics |
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STM32F302C8 Fiches technique(HTML) 119 Page - STMicroelectronics |
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119 / 139 page ![]() DS9896 Rev 8 119/139 STM32F302x6 STM32F302x8 Package information 134 7.1 WLCSP49 package information WLCSP49 is a 49-pin, 3.417 x 3.151 mm, 0.4 mm pitch wafer level chip scale package. Figure 37. WLCSP49 outline 1. Drawing is not to scale. Bottom view Bump side Side view Front view Top view Wafer back side A1 ball location e1 F G e e e2 E D A A2 Detail A A1 bbb Z Detail A (rotated 90 ) Seating plane Note 1 Note 2 Bump 49x eee Z Orientation reference A1 (4x) D E A3 A2 b A0XJ_ME_V1 A1 |
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