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STM8L151C2 Fiches technique(PDF) 116 Page - STMicroelectronics |
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STM8L151C2 Fiches technique(HTML) 116 Page - STMicroelectronics |
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116 / 123 page ![]() Package information STM8L151x2, STM8L151x3 116/123 DS7204 Rev 11 Figure 55. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package footprint 1. Dimensions are expressed in millimeters. k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. Table 61. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. YA_FP_V1 7.10 4.40 0.25 0.25 6.25 1.35 0.40 0.65 1.35 1 20 11 10 |
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