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STM32F732IE Fiches technique(PDF) 216 Page - STMicroelectronics |
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STM32F732IE Fiches technique(HTML) 216 Page - STMicroelectronics |
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216 / 226 page ![]() Package information STM32F732xx STM32F733xx 216/226 DS11854 Rev 6 Figure 94. UFBGA(176+25) - Recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 122. UFBGA(176+25) - Recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 121. UFBGA(176+25) - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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