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MMPF0200 Fiches technique(PDF) 106 Page - NXP Semiconductors |
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MMPF0200 Fiches technique(HTML) 106 Page - NXP Semiconductors |
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106 / 114 page ![]() 106 NXP Semiconductors PF0200 PACKAGING 8 Packaging 8.1 Packaging dimensions Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.freescale.com and perform a keyword search for the drawing’s document number. See the Thermal characteristics section for specific thermal characteristics for each package. Table 124. Package drawing information Package Suffix Package outline drawing number 56 QFN 8x8 mm - 0.5 mm pitch. E-Type (full lead) EP 98ASA00405D 56 QFN 8x8 mm - 0.5 mm pitch. WF-Type (wettable flank) ES 98ASA00589D |
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