IN-BAND Datasheet(PDF) - 625 - Aries Electronics, Inc.

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IN-BAND Fiches technique, PDF

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Mot-clé recherché : 'IN-BAND' - Totale: 15 (1/1) Pages

Fabricant	No de pièce	Fiches technique	Description
Aries Electronics, Inc.	625	937Kb/1P	Available in either Screw Machine or Coined Contacts in a Variety of Styles
	10002	716Kb/1P	High-Temp Universal ZIF DIP Burn-in & Test Socket
	F40	447Kb/1P	This female DIP strip is used in conjunction with Aries??Shorting
	10002HT	716Kb/1P	High-Temp 250째C Universal ZIF DIPBurn-in & Test Socket ??300째C Special Order
	351000	702Kb/1P	Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs
	651000	722Kb/1P	Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs
	501	610Kb/1P	Bifurcated Contacts in Standard DIP Sockets with Solder Tails or Wire Wrap Pins
	XX-666000-00	501Kb/1P	Allows the use of a narrow package IC in place of a wide one
	144-PRS12X12-12	841Kb/2P	ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid
	289-PRS17001-12	653Kb/2P	PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid Rev. 1.10
	537	529Kb/1P	Four Mounting Holes (2 Bifurcated) Mate with Mounting Post in Socket Base for Secure Assembly
	23026	803Kb/1P	Hi-Temp 200째C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
	23026HT	844Kb/1P	High-Temp 200째C Test & Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
	10004HT	1Mb/2P	High-Temp PGA ZIF Test & Burn-in Socket for Footprints on Std 8x8 to 21x21 Grid
	680	897Kb/1P	Complete versatility for programming within the unit itself, thus eliminating the need for DIP switches in many situations

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