Fabricant | No de pièce | Fiches technique | Description |
Molex Electronics Ltd. |
0877971200
|
260Kb / 4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76關m (30關) Gold (Au) Plating, 8.00mm (.315) Stacking Height
|
0010897063
|
432Kb / 4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 6 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
0879143205
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0879144405
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0015801061
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
|
0015477706
|
388Kb / 4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800065
|
1Mb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0010897300
|
432Kb / 4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
0015913280
|
1Mb / 8P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 28 Circuits 0.76關m (30關") Gold (Au) Selective Plating
|
0010897700
|
432Kb / 4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 70 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|