Fabricant | No de pièce | Fiches technique | Description |
Samsung semiconductor |
KAB01D100M
|
1Mb / 72P |
Multi-Chip Package MEMORY
|
SyncMOS Technologies,In... |
SM39R16A3
|
1Mb / 87P |
16KB on-chip program memory
|
Sames |
SA2532P
|
149Kb / 21P |
ONE MEMORY SINGLE CHIP TELEPHONE
|
NEC |
UPD2101AL
|
247Kb / 5P |
simple memory expansion-chip enable input
|
NIC-Components Corp. |
NEXC
|
113Kb / 3P |
V-Chip Memory Back-Up Capacitors
|
NEXCW
|
116Kb / 2P |
V-Chip Memory Back-Up Capacitors
|
NEC |
UPD2102AL
|
200Kb / 4P |
simple memory expansion-chip enable input
|
NIC-Components Corp. |
NEZVN-NEZVL
|
91Kb / 3P |
V-Chip Memory Back-Up Capacitors
|
NEZVL
|
91Kb / 3P |
V-Chip Memory Back-Up Capacitors
|
STMicroelectronics |
M28F256
|
715Kb / 20P |
256K(32K x8, Chip Erase)FLASH MEMORY
|